Plan Optik AG (Elsoff, Germany) and 4JET microtech (Alsdorf, Germany) have jointly developed a process chain for the highly productive production of metallized through-glass vias.
The new VLIS process (short for Volume Laser Induced Structuring) enables the production of high-precision TGV ("Through Glass Vias") for advanced packaging in glass wafers, or substrates for displays.
TGV are micro-holes with a diameter of typically 10µm to 100µm. For various applications in the advanced packaging sector, tens of thousands of these vias are applied per wafer and metallized to produce the required conductivity. TGVs are also used in the manufacture of displays, for example based on µLED. Previous methods for manufacturing have been slow, associated with high reject rates, and difficult to match to the metallization process
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João Raposo
+351 913 353 070
jraposo-air@portugalmail.pt
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